Dodecenylsuccinic Anhydride
- for Electron Microscopy
- Specification Assay :
- 95.0+% (Titration)
- Manufacturer :
- FUJIFILM Wako Pure Chemical Corporation
- Storage Condition :
- Protect from light.
- CAS RN® :
- 25377-73-5
- Molecular Formula :
- C16H26O3
- Molecular Weight :
- 266.38
- GHS :
-
- Structural Formula
- Label
- Packing
- SDS
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Comparison
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Product Number
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Package Size
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Price
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Availability
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Certificate of Analysis
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Purchase |
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200G
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In stock in Japan |
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500G
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In stock in Japan |
※Check availability in the US with the distributor.
Document
Overview / Applications
| Outline | Embedding give consistent and uniform hardness to tissues (blocks) as well as strength not deforming during sectioning by filling the hollow parts within the tissues. It also increases preservability including easiness for handling. While embedding with paraffin is usually employed for light microscopic observation and that with various resins for electron microscopic observation, use of freeze-sectioning instead of embedding is increasing. Various resins including epoxy resins are used as embedding agents for electron microscopy to meet the following requirements.- Not contracting upon polymerization.- Monomers are easy to handle and penetrate into tissues.- Clear and preferably colorless.- Polymerized resins are resistant to electron beams.- Polymers of appropriate hardness can be prepared.- Easy to section.Epoxy resin embedding materials are adjustable for hardness by altering the type and amount of addition of a hardening agent, polymerization catalyst, accelerator, etc. |
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Property
| Appearance | Yellow - yellowish brown, clear liquid |
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| Melting Point | < 0 degrees C |
| Flash Point | 185 degrees C |
| Density | 1.00 - 1.02g/ml (20 degrees C) |
Manufacturer Information
Alias
For research use or further manufacturing use only. Not for use in diagnostic procedures.
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